Three-dimensional profile measuring equipment

3次元形状測定装置

Abstract

(57)【要約】 【課題】 従来の3次元形状測定装置では、測定した領 域が被測定物のどこにあるか測定できない。誤差形状が 大きくなり、1マイクロメートル以下の形状測定には不 都合がある。接触球の真球度誤差、プローブの追従誤差 が測定精度を悪化させる等の課題があった。 【解決手段】 被測定物に設けた3つの球と、この3つ の球の中心位置を測定する中心位置測定部と、前記被測 定物表面上の点群を測定する点群測定部と、前記3つの 球の中心位置から被測定物の形状定義座標系の位置を計 算する位置計算部と、前記被測定物の表面上の点群を形 状定義座標系に座標変換する座標変換計算部と、前記座 標変換した測定結果に対して設計座標系位置を推定計算 する推定計算部とを備えたものである。
PROBLEM TO BE SOLVED: To measure the position and attitude of a surface to be measured with respect to a fixing reference by determining the position of a profile definition coordinate system from the central positions of three balls provided in an article to be measured, converting the position of a point group on the surface of the article into the position of the profile definition coordinate system and estimating the position of design coordinate. SOLUTION: A spherical face data acquisition means 20 traces spherical faces 7a-7c two-dimensionally by means of a probe, a spherical curve fit unit 21 determines the central position of each sphere and a coordinate conversion matrix calculator 22 determines the definition coordinate of spherical profile. A coordinate acquisition unit 23 acquires the coordinate of point group by tracing a face 1a to be measured two-dimensionally by means of a probe 6 and a coordinate converter 24 determines a profile definition coordinate. A normal vector calculator 25 determines a normal vector from a measured point group and a contact point position corrector 26 determines a contact point position based on the normal vector and the sphericality data 27 of a probe ball. A setting error corrector 28 calculates a profile error 30 and a setting error 31 based on the contact point and the design profile of a block 29.

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    JP-2009002771-AJanuary 08, 2009Nsk Ltd, 日本精工株式会社Shape measurement method of article and measuring instrument
    JP-2009539113-ANovember 12, 2009クオリティー ヴィジョン インターナショナル インコーポレイテッドQuality Vision International, Inc.測定の不確実性を考慮した多次元測定データの公差域への適合
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    US-7542872-B2June 02, 2009Mitutoyo CorporationForm measuring instrument, form measuring method and form measuring program
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